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Features: | - 5mm x 7mm Ceramic SMD | - 5V Supply Voltage | - Femtocell,WLAN,WiMAX,Wireless | - High precision down to ±0.05ppm |
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Frequency Range : |
| 5.000MHz to 52.000MHz |
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Temperature Stability : |
Frequency Tolerance @25°C vs. Temp vs. Aging vs. Voltage (with a 5% change) vs. Load (with a 10% change) | ±2.0ppm Choose from available options ±1ppm per year max. ±0.1ppm ±0.05ppm |
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Operating Temperature Range : |
| Choose from available options |
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Storage Temperature Range : |
| -55°C to +125°C |
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Supply Voltage (VDD) : |
±5% | 5.0VDC |
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Supply Current : |
| 3.5mA Maximum |
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Load Drive Capability : |
| 10kOhms // 10pF |
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Control Voltage Range : |
VDD = 3.3V | 2.5VDC ±2.5VDC |
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Transfer Function : |
| Positive Transfer Characteristic |
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Input Impedance : |
| 100kOhms Minimum |
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Pullability : |
VC Option | ±5ppm |
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Output Type : |
| Clipped Sinewave |
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Phase Noise : |
at 12.800MHz | -130dBc/Hz at offset of 100Hz -145dBc/Hz at offset of 1kHz -154dBc/Hz at offset of 10kHz |
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Pad 1 Connection : |
VC or No Connect | Choose from available options |
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Fine Leak Test : | MIL-STD-883, Method 1014, Condition A |
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Gross Leak Test : | MIL-STD-883, Method 1014, Condition C |
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Mechanical Shock : | MIL-STD-883, Method 1004 |
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Moisture Resistance : | MIL-STD-883, Method 1004 |
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Moisture Sensitivity : | J-STD-020, MSL 1 |
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Resistance to Soldering Heat : | MIL-STD-202, Method 210, Condition K |
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Resistance to Solvents : | MIL-STD-202, Method 215 |
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Solderability : | MIL-STD-883, Method 2003 |
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ESD Susceptibility : | MIL-STD-883, Method 3015, Class 1, HBM: 1500V |
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Temperature Cycling : | MIL-STD-883, Method 1010, Condition B |
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Vibration : | MIL-STD-883, Method 2007, Condition A |
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