Test Item

Test Condition

Test Result

Shock Resistance (Drop)

Natural drop on a hard wood board from a height of 75cm, three times

Frequency and waveform of tested products must remain within specifications.

Vibration

Vibration with amplitude of 0.762mm and sweep time of 1 minute at 10 to 55Hz for 2 hours on x,y and z axis

Frequency and waveform of tested products must remain within specifications.

Lead Strength

Lead Pull : 0.9 kg downward for 3 sec. Lead

Bend : Maximum bend of 90° reference to base for 2 bends

There should be no distortion in appearance.

Solderability

Dipping in solder(230° ±5°C) for 5 sec.

95% of the cooled solder surface is uniform and free from breaks and pinholes.

Resistance to
Solder Heat

Dipping in solder(260° ±5°C) for 10 sec.

Frequency and waveform of tested products must remain within specifications.

Temperature Cycle

Thermal shock of 3 cycles of dwell in baths of -55°C for 30min., +25°C for 15min., +85°C for 30min., +25°C for 15min.

Frequency and waveform of tested products must remain within specifications.

Moisture Resistance

Exposure to temperature of +40°C and humidity of 90% RH for 96 hours

Frequency and waveform of tested products must remain within specifications with no significant rusting.

Aging

30 days @ 85° C or 7 days @ 105°C

Deviation of frequency must be less than ±5ppm or custom specification.

Hermetical Seal 

Fine Leak: Measurement with mass spectrometer

Gross Leak: Test in de-ionized H 2 O

Leak rate less than 2x10 -8 Atmos CC/sec. of Helium

Air bubble would not be found in de-ionized H 2 O.